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TVS Diode Arrays (SPA ? Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — μDFN-6
Top View
Bottom View
Package
μDFN-6 (1.6x1.6x0.5mm)
6
D
5
4
A
L
4
D2
5
6
0.05 C
0.05 C
JEDEC
Symbol
Millimeters
Min Max
MO-229
Min
Inches
Max
E
E2
A
A1
0.45
0.00
0.55
0.05
0.018
0.000
0.022
0.002
Pin 1 Index Area
1
2
3
B
3
?
2
1
Pin 1 chamfer
0.10 x 45’
A3
b
D
0.20
1.55
0.152Ref
0.30
1.65
0.008
0.061
0.006 Ref
0.012
0.065
Side View
D2
1.05
1.30
0.042
0.052
0.05 C
A
A1
A3
Seating plane
E
E2
e
1.50
0.40
0.50 BSC
1.70
0.65
0.060 0.067
0.016 0.026
0.020BSC
C
L
0.164
0.316
0.006
0.012
b
0.10 M C A B
0.05 M C
Embossed Carrier Tape & Reel Speci?cation — μDFN-6
P2
t
Symbol
E
F
D1
Millimetres
Min Max
1.65
1.85
3.45
3.55
1.00
1.25
Min
0.06
0.14
0.04
Inches
Max
0.07
0.14
0.05
D
1.50 MIN
0.06 MIN
P0
3.90
4.10
0.15
0.16
10P0
40.0+/- 0.20
1.57+/-0.01
D1
A0
P0
W
P2
A0
B0
K0
7.90
1.95
1.78
1.78
0.84
8.30
2.05
1.88
1.88
0.94
0.31
0.08
0.07
0.07
0.03
0.33
0.08
0.07
0.07
0.04
User Feeding Direction
Pin 1 Location
t
0.25 TYP
0.01 TYP
?2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 09 2, 13
5
SP3012 Series
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